Electrophoretic deposition (EPD) is a material processing technique using deposition of charged particles in a stable colloidal suspension on a conductive substrate, acting as one of the two oppositely charged electrodes in the EPD cell. The deposited particles form the intended material or device. Both alternating current (AC) and direct current (DC) electrical fields have been applied in EPD process, although DC fields are more common.<br /> The electrophoretic deposition (EPD) technique with a wide range of novel applications in the processing of advanced ceramic materials and coatings, has recently gained increasing interest both in academia and industrial sector not only because of the high versatility of its use with different materials and their combinations but also because of its cost-effectiveness requiring simple apparatus.<br /> In EPD, the state of particles in suspension and their evolution during the process can be controlled and manipulated. Moreover, appropriate and accurate choice of processing variables could enable production of dense and homogeneous or porous microstructures. A combustible substrate that can be removed by further heating in sintering process is used for fabricating complicated shapes. But for coatings, the operator needs to be very cautious about possible cracks due to drying and sintering. These thermally derived cracks are the impartible nature of the technique and the quality of the final surface depends on overcoming this problem.<br /> Electrophoretic deposition (EPD) has been known since 1808 when the Russian scientist Ruess observed an electric field induced movement of clay particles in water. But the first practical use of the techniques occurred in 1933 when the deposition of thoria particles on a platinum cathode as an emitter for electron tube application was patented in USA. The first largescale application of EPD dates back to early 1950s, when the scientists used this method to make insulating Al2O3 layers on cathode heaters in vacuum tubes.